Rigid/HDI PCB
8-Layer HDI
S1000-2M+SF202 material
2.0mm Board Thickness
ENIG 2U” Surface treatment
Green solder mask
Blind holes: L8-L7
8-Layer Rigid
FR4 370HR material
1.56mm Board Thickness
Semi-light green solder mask
Inner layer 2oz, Outer layer 4oz
Vias fill with resin
14-Layer HDI
ENIG 4U” Surface Treatment
Blind vias: L1-L2, L2-L3,
L14-L13, L13-L12
Buried holes: L3-L12
Vias fill with resin
10-Layer Rigid
FR4 TG150+IS400 Material
ENIG 2U”+ Gold finger 20U”
Vias fill with resin
Press-fit holes
Paragraphing Gold finger